Dicing in Semiconductor Manufacturing
Dicing is a critical step in semiconductor production, where a fully processed wafer is cut into individual chips or dies. This follows the complete formation of all electronic components on the wafer. The wafer is typically mounted on adhesive tape, then cut using either a diamond-edged blade or a laser, depending on the material and precision required.
After separation, the dies are picked for final packaging. The process demands high precision, as any thermal or mechanical stress can impact the quality and performance of the final devices.
Why Cooling is Critical in Dicing
Both blade and laser dicing generate significant heat, which, if unmanaged, can damage the wafer’s delicate structures. Process cooling systems are used to prevent any thermal stress, ensure clean cutting, and maintain consistent temperatures. Cooling methods vary depending on the process and environment, ranging from water-based fluid streams to air cooling, all designed to protect both the wafers and the equipment from heat-related degradation.
The Role of Recirculating Chillers
Recirculating chillers are widely used in dicing applications to provide consistent temperature regulation. They circulate heat transfer fluids to absorb and dissipate heat generated during cutting, improving precision and protecting sensitive equipment. Chillers also boost productivity by reducing downtime for temperature stabilisation.
While they offer high efficiency and performance, they require space, regular maintenance, and represent a significant initial investment.
Water-to-Water Heat Exchangers
Water-to-water heat exchangers offer clean, energy-efficient cooling, ideal for semiconductor environments where contamination must be avoided. These systems transfer heat between two isolated water circuits, often forming part of closed-loop systems within cleanrooms.
While effective and scalable, they require good water quality and regular maintenance, and their installation can be complex.
Airblast Coolers in Dicing Applications
Airblast coolers can be used in facilities where water usage is restricted or where simpler systems are preferred. These systems use ambient air to cool heat transfer fluids and are valued for their low water use, reduced maintenance, and environmental friendliness.
However, their efficiency depends on ambient temperature and they require adequate space and protection from dust and debris.
Choosing the Right Heat Transfer Fluid
The performance of any cooling system relies heavily on the heat transfer used. The ideal fluid should offer high thermal conductivity, chemical stability, low viscosity, and minimal environmental impact. Selecting the right fluid ensures optimal performance and protection of both the process and equipment.
Options include:
Excellent thermal properties and cost-effective; ideal for clean applications but may require additives to prevent corrosion.
Used for temperature stability in variable environments; lower freezing point and higher boiling point make them suitable for more demanding conditions.
Offer chemical stability and low toxicity; preferred in precision or high-temperature applications where contamination risks must be minimised.
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